1-1. Material management
1-1-1.
Standards of BGA / IC / PCB Incoming & management :
[1]
Incoming
1) IC & PCB should be warehoused in
vacuum packing.
[2]
Inspection : Conduct inspection available in vacuum packing.
1) When incoming BGA & PCB gets NG
after inspection,
- IQA inspector should inform the person
in charge and
receive an order,
or return to the maker if
possible.
※ NG criteria
- When parts are not in vacuum packing,
or air flows in due to packing damage.
- When actual parts are different to the
details in inspection record by Maker.
2) when appear the NG of components about
vacuum packing, if NG components
can not be return, after components baking and then processing the vacuum
packing.
can not be return, after components baking and then processing the vacuum
packing.
3) If the validity of IC had expired, inform Manager or return it.
(Even
more than one year IC in vacuum packing)
[3]
Storage
1) Must separate parts for ordinary & Pb free.
2) BGA, IC & PCB must be stored in
vacuum packing.
※ BGA and IC’s store standards must apply
the criteria that attached IC packing
※ Standard of storage temperature/humidity
: 25 ± 5℃, 50±10%
3) Store separately by lot for First-in,
First-out (FIFO)
[4]
Use
1)Open IC envelope and PCB box before
production.
2)Remained IC & PCB after opening, vacuum
pack in 30 minutes
and
store.
(after 30 minutes, vacuum pack after Baking)
(after 30 minutes, vacuum pack after Baking)
3)After opening, operators must wear anti-static gloves and wrist
strap to
protect
IC & PCB.
IC & PCB.
4)Write down opening date and time on the
envelope to prevent IC from absorbing
moisture and PCB oxidation. And It should manage envelope and tray
in attaching tag
moisture and PCB oxidation. And It should manage envelope and tray
in attaching tag
5)Opened IC in standby state must be stored
in related line before production
completed.
completed.
5]
Remainder handling
1) Opened IC & PCB must be used in
24 hrs, if
it’s impossible,
① Store in vacuum packing with silica gel after baking within 30min
② After store in dry chamber during 24 Hours, use it
(But, can use within unpacking 24
hours)
2) Reel parts must be baked on low
temperature(40℃)
※ But, MSL level 6 immediately use after unpacking within “Time on Label”
※Baking standards : 125℃,12~48 hrs. (Refer
baking table or part maker’s recommendation)
※ Temperature/Humidity standard of dry
chamber : 25 ± 5℃, 10%↓
※ Reuse process of Silica-gel
1)
Collect remaining Silica gel after open vacuum packing IC, and store it on
guarantee place.
guarantee place.
2) Silica gel should bake in can see silica
gel’s cover conditions.
- Baking Standard : 125℃, 16Hrs
ex)
à Baking standards: 118℃(245℉)/16hrs
ex)
- Standard of storing when baking : It
should spread. No fold.
3) Input dry chamber after completing Bake
4) When vacuum packing remaining IC, It
enclose silica gel in dry chamber
- Enclosed amount : 1unit or 2unit (Obey
standard of Maker)
- If materials let out the storage, material’s quantify must have to
limit according
to used within 24hrs. (If procedure plans of same model is fixed more than a day,
divide by 24 hours the material is exported.)
to used within 24hrs. (If procedure plans of same model is fixed more than a day,
divide by 24 hours the material is exported.)
- Remained material immediately must
have to vacuum pack with silica gel.
- If storage with vacuum packing after
proceed a materials baking, in below
case(include silica gel)
case(include silica gel)
- Remained IC that it used in SMT
line
- Over the 24hrs from open time
- IC incoming with not vacuum packing
- Baking chamber caution
- If vacuum chamber are used at
another IC, baking after store the dry chamber.
- If
baking is in progress about tray, reel, silica-gel, worker have to use
the
specified temperature/time condition.
specified temperature/time condition.
- If baking process is impossible
material about the reel components, worker
must only vacuum packing. (Reel components have to exhaust within use-by date)
must only vacuum packing. (Reel components have to exhaust within use-by date)
To be continued ...
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